Inventor · disambiguated record
Takahiro Sugimura
Also filed as: SUGIMURA TAKAHIRO
6 granted patents·8 pending applications·11 citations·filing 2003–2024
75Inventor score
Files withSUMITOMO ELECTRIC INDUSTRIES4RENESAS TECH CORP3RENESAS ELECTRONICS CORP2SUGIMURA TAKAHIRO2TOYO INK MFG CO2
Top patents by PatentIndex Score
14 records- 0175US7838335B2Manufacturing method of semiconductor device with a mold resin having a mold release agentRENESAS ELECTRONICS CORP·Filed 2008·Granted Nov 23, 2010·6 cites·5 claims
- 0271US2025070093A1Power modules and methods for assembling power modulesMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 0366US7834455B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Nov 16, 2010·2 cites·4 claims
- 0462US7459342B2Manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted Dec 2, 2008·2 cites·8 claims
- 0556US2006094806A1Aqueous emulsion based pressure sensitive adhesive and pressure sensitive adhesive sheet employing sameTOYO INK MFG CO·Filed 2005·Application pending·0 cites
- 0654US8101468B2Method of manufacturing a semiconductor deviceSUGIMURA TAKAHIRO·Filed 2010·Granted Jan 24, 2012·1 cites·4 claims
- 0751US7547968B2Semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted Jun 16, 2009·0 cites·8 claims
- 0850US2003212195A1Aqueous emulsion based pressure sensitive adhesive and pressure sensitive adhesive sheet employing sameTOYO INK MFG CO·Filed 2003·Application pending·0 cites
- 0938US8896114B2Semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2013·Granted Nov 25, 2014·0 cites·3 claims
- 1038US2008036083A1Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2007·Application pending·0 cites
- 1136US2013270706A1Semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2013·Application pending·0 cites
- 1236US2013256920A1Semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2013·Application pending·0 cites
- 1335US2013249008A1Semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2013·Application pending·0 cites
- 1433US2012306086A1Semiconductor device and wiring substrateSUGIMURA TAKAHIRO·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →