Inventor
Tai Chih-Hsuan
TW51 patents
Patents
50 patentsUS9691708B1Jun 27, 2017
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD26 citations94
US11004786B2May 11, 2021
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations86
US10832985B2Nov 10, 2020
Sensor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations85
US11251141B2Feb 15, 2022
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10510631B2Dec 17, 2019
Fan out package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US11848300B2Dec 19, 2023
Semiconductor structure including a semiconductor wafer and a surface mount component overhanging a periphery of the semiconductor wafer
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations75
US12068212B2Aug 20, 2024
Package structure with through via extending through redistribution layer and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11929318B2Mar 12, 2024
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11742254B2Aug 29, 2023
Sensor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11635566B2Apr 25, 2023
Package and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11614592B2Mar 28, 2023
Semiconductor devices and methods of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11444002B2Sep 13, 2022
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11424213B2Aug 23, 2022
Semiconductor structure including a first surface mount component and a second surface mount component and method of fabricating the semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11374136B2Jun 28, 2022
Semiconductor package and forming method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11309225B2Apr 19, 2022
Fan-out package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10878073B2Dec 29, 2020
Fingerprint sensor pixel array and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10840227B2Nov 17, 2020
Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US10762319B2Sep 1, 2020
Fingerprint sensor and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10672729B2Jun 2, 2020
Package structure and method of forming package structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10157274B2Dec 18, 2018
Fingerprint sensor pixel array and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9904776B2Feb 27, 2018
Fingerprint sensor pixel array and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US12222545B2Feb 11, 2025
Package and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations64
US12431446B2Sep 30, 2025
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12009322B2Jun 11, 2024
Package structure with through-via in molding compound and dielectric layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12557707B2Feb 17, 2026
Method of fabricating package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12512372B2Dec 30, 2025
Semiconductor structure with testing pads and method of manufacturing thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12500200B2Dec 16, 2025
Package structure with conductive patterns in a redistribution layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12362274B2Jul 15, 2025
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12334434B2Jun 17, 2025
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12278208B2Apr 15, 2025
Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a wafer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12205860B2Jan 21, 2025
Sensor packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12100682B2Sep 24, 2024
Package structure with conductive patterns in a redistribution layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12015017B2Jun 18, 2024
Package structure, package-on-package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11855232B2Dec 26, 2023
Semiconductor package and forming method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11847852B2Dec 19, 2023
Manufacturing method of fingerprint sensor
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11749582B2Sep 5, 2023
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11631658B2Apr 18, 2023
Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11580767B2Feb 14, 2023
Fingerprint sensor
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11527525B2Dec 13, 2022
Semiconductor device with multiple polarity groups
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11322421B2May 3, 2022
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11049850B2Jun 29, 2021
Methods of bonding the strip-shaped under bump metallization structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11011501B2May 18, 2021
Package structure, package-on-package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10861841B2Dec 8, 2020
Semiconductor device with multiple polarity groups
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12469768B2Nov 11, 2025
Semiconductor package structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12125810B2Oct 22, 2024
Delamination sensor
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11616029B2Mar 28, 2023
Delamination sensor
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11158555B2Oct 26, 2021
Package structure having sensor die with touch sensing electrode, and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10698994B2Jun 30, 2020
Fingerprint sensor pixel array and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10658348B2May 19, 2020
Semiconductor devices having a plurality of first and second conductive strips
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10157808B2Dec 18, 2018
Package structure and method of forming package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
Showing the top 50 of 51 patents by PatentIndex Score.