Inventor

CHEN CHIH-HUA

TW127 patents

⚠️ This page may combine multiple inventors who share the name “CHEN CHIH-HUA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN CHIH-HUA

TAIWAN SEMICONDUCTOR MFG CO LTD

Package structures and method of forming the same

Semiconductor package and manufacturing method thereof

Semicondcutor package and method of manufacturing the same

Package structure

Semiconductor package and manufacturing process thereof

Packaging mechanisms for dies with different sizes of connectors

Package structures and methods for forming the same

Fan out package structure and method of manufacturing the same

Packaging mechanisms for dies with different sizes of connectors

Semiconductor package and manufacturing process thereof

Fingerprint sensor device and method

Method for forming a passive device on a package-on-package structure

Package structure and method of fabricating the same

Metal routing architecture for integrated circuits

Fingerprint sensor device and method

Packaging mechanisms for dies with different sizes of connectors

Multi-chip package system and methods of forming the same

Pop structures and methods of forming the same

Methods and apparatus for forming package-on-packages

Package structure with through via extending through redistribution layer and method of manufacturing the same

Semiconductor package and method of manufacturing the same

Packaging mechanisms for dies with different sizes of connectors

Package structure with porous conductive structure and manufacturing method thereof

Fan-out package structure and method of manufacturing the same

Semiconductor package and method of manufacturing the same

Package structures and method of forming the same

TAIWAN SEMICONDUCTOR MFG

POP structures and methods of forming the same

Tapered through-silicon via structure

Passive devices in package-on-package structures and methods for forming the same

Through-substrate via for semiconductor device

Tapered through-silicon via structure

Metal routing architecture for integrated circuits

Apparatus and method for a component package

Through-silicon via with scalloped sidewalls

Multi-die wafer level packaging

Through silicon via with dummy structure and method for forming the same

Package-on-package structure without through assembly vias

Semiconductor structure with a discontinuous material density for reducing eddy currents

CHEN CHIH-HUA

Through-silicon vias and methods for forming the same

PoP structures including through-assembly via modules

Through-assembly via modules and methods for forming the same

Zigzag pattern for TSV copper adhesion

Bump-on-trace structures in packaging

Fan module with vibration-resistent mounting

Rack server center

Method of forming through silicon via with dummy structure

HU YEN-CHANG

Methods and apparatus for package on package devices with reversed stud bump through via interconnections

HSIAO CHING-WEN

Package structures and methods for forming the same

LIU TZUAN-HORNG

Dummy metal design for packaging structures

HEWLETT PACKARD DEVELOPMENT CO

Gaze-based window adjustments