Inventor
KUO TING-TING
TW30 patents
⚠️ This page may combine multiple inventors who share the name “KUO TING-TING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
28 patentsUS10832985B2Nov 10, 2020
Sensor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations85
US11251141B2Feb 15, 2022
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10510631B2Dec 17, 2019
Fan out package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US12068212B2Aug 20, 2024
Package structure with through via extending through redistribution layer and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11742254B2Aug 29, 2023
Sensor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11309225B2Apr 19, 2022
Fan-out package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10840227B2Nov 17, 2020
Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US10762319B2Sep 1, 2020
Fingerprint sensor and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10672729B2Jun 2, 2020
Package structure and method of forming package structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US12431446B2Sep 30, 2025
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12009322B2Jun 11, 2024
Package structure with through-via in molding compound and dielectric layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12557707B2Feb 17, 2026
Method of fabricating package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12322716B2Jun 3, 2025
Heat dissipating features for laser drilling process
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12205860B2Jan 21, 2025
Sensor packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12015017B2Jun 18, 2024
Package structure, package-on-package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11847852B2Dec 19, 2023
Manufacturing method of fingerprint sensor
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11631658B2Apr 18, 2023
Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11580767B2Feb 14, 2023
Fingerprint sensor
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11527525B2Dec 13, 2022
Semiconductor device with multiple polarity groups
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11049850B2Jun 29, 2021
Methods of bonding the strip-shaped under bump metallization structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11011501B2May 18, 2021
Package structure, package-on-package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10861841B2Dec 8, 2020
Semiconductor device with multiple polarity groups
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12476178B2Nov 18, 2025
Reduction of cracks in redistribution structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12469807B2Nov 11, 2025
Fan-out package structures with cascaded openings in enhancement layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US11158555B2Oct 26, 2021
Package structure having sensor die with touch sensing electrode, and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10658348B2May 19, 2020
Semiconductor devices having a plurality of first and second conductive strips
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10157808B2Dec 18, 2018
Package structure and method of forming package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US11842993B2Dec 12, 2023
Semiconductor device with multiple polarity groups
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51