Inventor
TSENG YING-CHENG
TW32 patents
⚠️ This page may combine multiple inventors who share the name “TSENG YING-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
28 patentsUS11004786B2May 11, 2021
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations86
US10832985B2Nov 10, 2020
Sensor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations85
US10074615B1Sep 11, 2018
Package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84
US12113022B2Oct 8, 2024
Semiconductor package and manufacturing method of semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations75
US11929318B2Mar 12, 2024
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11742254B2Aug 29, 2023
Sensor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11374136B2Jun 28, 2022
Semiconductor package and forming method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11355466B2Jun 7, 2022
Package structure and manufacturing method of package structure thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10840227B2Nov 17, 2020
Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US10762319B2Sep 1, 2020
Fingerprint sensor and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US12557707B2Feb 17, 2026
Method of fabricating package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12362274B2Jul 15, 2025
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12334434B2Jun 17, 2025
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12205860B2Jan 21, 2025
Sensor packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12051666B2Jul 30, 2024
Package structure and manufacturing method of package structure thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12015017B2Jun 18, 2024
Package structure, package-on-package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11855232B2Dec 26, 2023
Semiconductor package and forming method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11847852B2Dec 19, 2023
Manufacturing method of fingerprint sensor
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11631658B2Apr 18, 2023
Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11580767B2Feb 14, 2023
Fingerprint sensor
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11527525B2Dec 13, 2022
Semiconductor device with multiple polarity groups
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11049850B2Jun 29, 2021
Methods of bonding the strip-shaped under bump metallization structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11011501B2May 18, 2021
Package structure, package-on-package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10861841B2Dec 8, 2020
Semiconductor device with multiple polarity groups
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11164819B2Nov 2, 2021
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US11158555B2Oct 26, 2021
Package structure having sensor die with touch sensing electrode, and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10658348B2May 19, 2020
Semiconductor devices having a plurality of first and second conductive strips
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US11842993B2Dec 12, 2023
Semiconductor device with multiple polarity groups
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51