Inventor

HUANG Xin-hua

TW68 patents

⚠️ This page may combine multiple inventors who share the name “HUANG Xin-hua”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUANG Xin-hua

TAIWAN SEMICONDUCTOR MFG CO LTD

Air trench in packages incorporating hybrid bonding

Hybrid bonding systems and methods for semiconductor wafers

Hybrid bonding mechanisms for semiconductor wafers

Wafer bonding process and structure

Structure and formation method of semiconductor device structure

Alignment systems and wafer bonding systems and methods

3D trench capacitor for integrated passive devices

Integrate rinse module in hybrid bonding platform

Hybrid bonding systems and methods for semiconductor wafers

Air trench in packages incorporating hybrid bonding

Hybrid bonding systems and methods for semiconductor wafers

Apparatus and method for wafer level bonding

Integrate rinse module in hybrid bonding platform

3D trench capacitor for integrated passive devices

Substrate loss reduction for semiconductor devices

Apparatus for bond wave propagation control

Apparatus for bond wave propagation control

Wafer bonding process and structure

Apparatus and method for wafer level bonding

Alignment systems and wafer bonding systems and methods

Apparatus and method for cleaning

Multiple metal layer semiconductor device and low temperature stacking method of fabricating the same

Method of semiconductor wafer bonding and system thereof

Deposition system for high accuracy patterning

Integrate rinse module in hybrid bonding platform

Patterning a transparent wafer to form an alignment mark in the transparent wafer

Integrate rinse module in hybrid bonding platform

Deposition system for high accuracy patterning

Patterning a transparent wafer to form an alignment mark in the transparent wafer

Low contamination chamber for surface activation

Integrate rinse module in hybrid bonding platform

Approach for ultra thin-film transfer and handling

Debonding schemes

3D trench capacitor for integrated passive devices

Simultaneous bonding approach for high quality wafer stacking

Substrate loss reduction for semiconductor devices

Conductive bond structure to increase membrane sensitivity in MEMS device

Apparatus for bond wave propagation control

Substrate loss reduction for semiconductor devices

Simultaneous bonding approach for high quality wafer stacking applications

Conductive bond structure to increase membrane sensitivity in MEMS device

TAIWAN SEMICONDUCTOR MFG

Methods for hybrid wafer bonding

Hybrid bonding mechanisms for semiconductor wafers

Hybrid bonding and apparatus for performing the same

LIU PING-YIN

Three dimensional integrated circuit structures and hybrid bonding methods for semiconductor wafers

Hybrid bonding systems and methods for semiconductor wafers

MEMS structures and methods for forming the same

YANG YAO-JOE

Fabrication method of a flexible capacitive pressure sensor

HUANG HSIN-TING

Method of fabricating a semiconductor device having recessed bonding site

HUANG Xin-hua

Methods of bonding caps for MEMS devices