Inventor
RYU JOUNG GUL
KR37 patents
⚠️ This page may combine multiple inventors who share the name “RYU JOUNG GUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
31 patentsUS7893527B2Feb 22, 2011
Semiconductor plastic package and fabricating method thereof
SAMSUNG ELECTRO MECH14 citations82
US11158453B2Oct 26, 2021
Coil component
SAMSUNG ELECTRO MECH2 citations73
US11094458B2Aug 17, 2021
Coil component and method for manufacturing the same
SAMSUNG ELECTRO MECH2 citations72
US10923266B2Feb 16, 2021
Coil component
SAMSUNG ELECTRO MECH3 citations72
US10553346B2Feb 4, 2020
Thin film inductor and method of manufacturing the same
SAMSUNG ELECTRO MECH3 citations72
US11145452B2Oct 12, 2021
Inductor and method for manufacturing the same
SAMSUNG ELECTRO MECH2 citations71
US12293867B2May 6, 2025
Coil component
SAMSUNG ELECTRO MECH0 citations62
US12224100B2Feb 11, 2025
Coil component
SAMSUNG ELECTRO MECH0 citations62
US12046413B2Jul 23, 2024
Coil component
SAMSUNG ELECTRO MECH0 citations62
US11862386B2Jan 2, 2024
Coil component
SAMSUNG ELECTRO MECH0 citations62
US11721475B2Aug 8, 2023
Coil component
SAMSUNG ELECTRO MECH0 citations62
US11107622B2Aug 31, 2021
Coil component
SAMSUNG ELECTRO MECH0 citations62
US11037718B2Jun 15, 2021
Coil component
SAMSUNG ELECTRO MECH0 citations62
US10998125B2May 4, 2021
Coil component
SAMSUNG ELECTRO MECH0 citations62
US11721473B2Aug 8, 2023
Coil component
SAMSUNG ELECTRO MECH0 citations61
US11127523B2Sep 21, 2021
Inductor
SAMSUNG ELECTRO MECH0 citations61
US10984942B2Apr 20, 2021
Coil component
SAMSUNG ELECTRO MECH1 citations61
US12033784B2Jul 9, 2024
Coil component
SAMSUNG ELECTRO MECH0 citations52
US11923124B2Mar 5, 2024
Coil component
SAMSUNG ELECTRO MECH0 citations52
US11830662B2Nov 28, 2023
Coil component
SAMSUNG ELECTRO MECH0 citations52
US11574765B2Feb 7, 2023
Coil component
SAMSUNG ELECTRO MECH0 citations52
US11398343B2Jul 26, 2022
Coil component
SAMSUNG ELECTRO MECH0 citations52
US10796840B2Oct 6, 2020
Coil component
SAMSUNG ELECTRO MECH0 citations52
US9456492B2Sep 27, 2016
Printed circuit board with warpage prevention layer
SAMSUNG ELECTRO MECH0 citations52
US11830655B2Nov 28, 2023
Coil component
SAMSUNG ELECTRO MECH0 citations51
US11380475B2Jul 5, 2022
Coil component
SAMSUNG ELECTRO MECH0 citations51
US11488762B2Nov 1, 2022
Chip inductor and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations50
US8926714B2Jan 6, 2015
Heat dissipating substrate and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations50
US11664154B2May 30, 2023
Coil component
SAMSUNG ELECTRO MECH0 citations48
US10741321B2Aug 11, 2020
Thin film type inductor
SAMSUNG ELECTRO MECH0 citations41
US10707009B2Jul 7, 2020
Thin film-type inductor
SAMSUNG ELECTRO MECH0 citations41