Inventor
CHU YEN-JUI
TW13 patents
Patents
13 patentsUS10697919B2Jun 30, 2020
Reduction-oxidation sensor device and manufacturing method thereof
WINBOND ELECTRONICS CORP5 citations72
US11322438B2May 3, 2022
Package structure and manufacturing method thereof
WINBOND ELECTRONICS CORP0 citations62
US11658138B2May 23, 2023
Semiconductor device including uneven contact in passivation layer
WINBOND ELECTRONICS CORP0 citations59
US11309267B2Apr 19, 2022
Semiconductor device including uneven contact in passivation layer and method of manufacturing the same
WINBOND ELECTRONICS CORP0 citations59
US11145596B2Oct 12, 2021
Package structure and method of forming the same
WINBOND ELECTRONICS CORP0 citations59
US10277995B2Apr 30, 2019
Bone conduction hearing aid device and bone conduction speaker
WINBOND ELECTRONICS CORP0 citations51
US11063010B2Jul 13, 2021
Redistribution layer (RDL) structure and method of manufacturing the same
WINBOND ELECTRONICS CORP0 citations50
US12119261B2Oct 15, 2024
Semiconductor structure and manufacturing method of the same
WINBOND ELECTRONICS CORP0 citations49
US11610857B2Mar 21, 2023
Method of manufacturing circuit structure
WINBOND ELECTRONICS CORP0 citations49
US10842421B2Nov 24, 2020
Sensing device, nursing bra, and manufacturing method thereof
WINBOND ELECTRONICS CORP0 citations40
US10818497B2Oct 27, 2020
Patterned structure for electronic device and manufacturing method thereof
WINBOND ELECTRONICS CORP0 citations40
US10658320B1May 19, 2020
Semiconductor device including conductive structure
WINBOND ELECTRONICS CORP0 citations40
US10282964B2May 7, 2019
Gas detecting device
WINBOND ELECTRONICS CORP0 citations40