P

Inventor

CHENG MING-LUNG

TW24 patents
⚠️ This page may combine multiple inventors who share the name “CHENG MING-LUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

20 patents
US9768277B2Sep 19, 2017

Method and apparatus of forming an integrated circuit with a strained channel region

TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US10522417B2Dec 31, 2019

FinFET device with different liners for PFET and NFET and method of fabricating thereof

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US12166071B2Dec 10, 2024

Dielectric fins with air gap and backside self-aligned contact

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11217679B2Jan 4, 2022

Semiconductor device and method

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12191370B2Jan 7, 2025

Semiconductor device with tunable channel layer usage and methods of fabrication thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12154946B2Nov 26, 2024

Semiconductor device structure

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12142668B2Nov 12, 2024

Semiconductor device and method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11810827B2Nov 7, 2023

FinFET device with different liners for PFET and NFET and method of fabricating thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11688767B2Jun 27, 2023

Semiconductor device structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11031299B2Jun 8, 2021

FinFET device with different liners for PFET and NFET and method of fabricating thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12527050B2Jan 13, 2026

Integrated circuit structure with source/drain spacers

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12414331B2Sep 9, 2025

Isolation for multigate devices

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12324218B2Jun 3, 2025

Semiconductor devices with air gaps and the method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11837631B2Dec 5, 2023

Source/drain spacer with air gap in semiconductor devices and methods of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11688768B2Jun 27, 2023

Integrated circuit structure with source/drain spacers

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11600695B2Mar 7, 2023

Dielectric fins with air gap and backside self-aligned contact

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12396234B2Aug 19, 2025

Method for forming semiconductor device structure with a cap layer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations56
US12389653B2Aug 12, 2025

Semiconductor devices and methods of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12278276B2Apr 15, 2025

Multi-channel devices and method with anti-punch through process

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12446261B2Oct 14, 2025

Multi-gate devices and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations46

TAIWAN SEMICONDUCTOR MFG

3 patents

CHENG MING-LUNG

1 patent