Inventor · disambiguated record
Frank Z. Hawrylo
Also filed as: HAWRYLO FRANK Z · HAWRYLO FRANK ZYGMUNT
25 granted patents·336 citations·filing 1974–1987
96Inventor score
Top patents by PatentIndex Score
25 records- 0192US4484332AMultiple double heterojunction buried laser deviceUS AIR FORCE·Filed 1982·Granted Nov 20, 1984·45 cites·10 claims
- 0288US4394679ALight emitting device with a continuous layer of copper covering the entire headerRCA CORP·Filed 1980·Granted Jul 19, 1983·48 cites·6 claims
- 0382US4540115AFlux-free photodetector bondingRCA CORP·Filed 1983·Granted Sep 10, 1985·52 cites·9 claims
- 0478US3945902AMetallized device and method of fabricationRCA CORP·Filed 1974·Granted Mar 23, 1976·14 cites·6 claims
- 0577US4095011AElectroluminescent semiconductor device with passivation layerRCA CORP·Filed 1976·Granted Jun 13, 1978·34 cites·4 claims
- 0673US4514265ABonding pads for semiconductor devicesRCA CORP·Filed 1984·Granted Apr 30, 1985·29 cites·5 claims
- 0759US4479222ADiffusion barrier for long wavelength laser diodesUS AIR FORCE·Filed 1982·Granted Oct 23, 1984·22 cites·1 claims
- 0856US4523212ASimultaneous doped layers for semiconductor devicesUS AIR FORCE·Filed 1982·Granted Jun 11, 1985·12 cites·2 claims
- 0953US3984261AOhmic contactRCA CORP·Filed 1975·Granted Oct 5, 1976·12 cites·4 claims
- 1051US4097636AMetallized deviceRCA CORP·Filed 1975·Granted Jun 27, 1978·8 cites·2 claims
- 1150US4024569ASemiconductor ohmic contactRCA CORP·Filed 1975·Granted May 17, 1977·10 cites·11 claims
- 1245US4547230ALPE Semiconductor material transfer methodUS AIR FORCE·Filed 1984·Granted Oct 15, 1985·6 cites·4 claims
- 1340US4614292ADie bonder with electrically driven scrubbing meansRCA CORP·Filed 1985·Granted Sep 30, 1986·8 cites·4 claims
- 1439US4182995ALaser diode with thermal conducting, current confining filmRCA CORP·Filed 1978·Granted Jan 8, 1980·4 cites·5 claims
- 1537US4214550AApparatus for the deposition of a material from a liquid phaseRCA CORP·Filed 1979·Granted Jul 29, 1980·3 cites·6 claims
- 1637US4195308AOhmic contact for P type indium phosphideRCA CORP·Filed 1978·Granted Mar 25, 1980·3 cites·7 claims
- 1736US4576326AMethod of bonding semiconductor devices to heatsinksRCA CORP·Filed 1984·Granted Mar 18, 1986·6 cites·3 claims
- 1832US4609139AMethod of burnishing malleable films on semiconductor substratesRCA CORP·Filed 1984·Granted Sep 2, 1986·3 cites·7 claims
- 1931US4693649ASharp edge formation on copper heatsinksRCA CORP·Filed 1985·Granted Sep 15, 1987·3 cites·6 claims
- 2031US4540450AInP:Te Protective layer process for reducing substrate dissociationUS AIR FORCE·Filed 1984·Granted Sep 10, 1985·3 cites·6 claims
- 2131US4439399AQuaternary alloyUS AIR FORCE·Filed 1982·Granted Mar 27, 1984·3 cites·2 claims
- 2230US4203785AMethod of epitaxially depositing cadmium sulfideRCA CORP·Filed 1978·Granted May 20, 1980·1 cites·10 claims
- 2329US4491264AMethod of soldering a light emitting device to a substrateRCA CORP·Filed 1982·Granted Jan 1, 1985·0 cites·7 claims
- 2426US4612211ASelective semiconductor coating and protective mask thereforRCA CORP·Filed 1983·Granted Sep 16, 1986·5 cites·8 claims
- 2523US4759829ADevice header and method of making sameRCA CORP·Filed 1987·Granted Jul 26, 1988·2 cites·8 claims
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