Inventor
KAKITANI MINORU
JP11 patents
⚠️ This page may combine multiple inventors who share the name “KAKITANI MINORU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI CHEMICAL CO LTD
7 patentsUS6720077B2Apr 13, 2004
Resin composition, and use and method for preparing the same
HITACHI CHEMICAL CO LTD12 citations71
US11377546B2Jul 5, 2022
Resin composition, laminate sheet, and multilayer printed wiring board
HITACHI CHEMICAL CO LTD1 citations59
US10907029B2Feb 2, 2021
Resin composition, resin layer-provided support, prepreg, laminate sheet, multilayer printed wiring board, and printed wiring board for millimeter-wave radar
HITACHI CHEMICAL CO LTD0 citations59
US10940674B2Mar 9, 2021
Resin varnish, prepreg, laminate, and printed wiring board
HITACHI CHEMICAL CO LTD0 citations56
US7538150B2May 26, 2009
Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resin
HITACHI CHEMICAL CO LTD0 citations49
US11136454B2Oct 5, 2021
Thermosetting resin composition and its production method, prepreg, laminate, and printed wiring board
HITACHI CHEMICAL CO LTD0 citations45
US10876000B2Dec 29, 2020
Thermosetting resin composition, prepreg, laminated board, printed wiring board, and high speed communication-compatible module
HITACHI CHEMICAL CO LTD0 citations45
RESONAC CORP
2 patentsUS12324105B2Jun 3, 2025
Maleimide resin composition, prepreg, resin film, laminated board, printed wiring board, and semiconductor package
RESONAC CORP0 citations59
US12024624B2Jul 2, 2024
Maleimide resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor package
RESONAC CORP0 citations56