Inventor
AKEBI RYUJI
JP3 patents
⚠️ This page may combine multiple inventors who share the name “AKEBI RYUJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RESONAC CORP
2 patentsUS12324105B2Jun 3, 2025
Maleimide resin composition, prepreg, resin film, laminated board, printed wiring board, and semiconductor package
RESONAC CORP0 citations59
US12024624B2Jul 2, 2024
Maleimide resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor package
RESONAC CORP0 citations56