Inventor

YAMADERA TAKASHI

JP3 patents

Patents

3 patents

US5532105AJul 2, 1996

Photolithographically viahole-forming photosensitive element comprising two photosensitive layers for the fabrication process of multilayer wiring board

HITACHI CHEMICAL CO LTD39 citations90

US6156870ADec 5, 2000

Resin composition which can be cured by application of heat or irradiation of light, film, laminate and production of multilayer wiring board

HITACHI CHEMICAL CO LTD22 citations89

US4454219AJun 12, 1984

Photosensitive resin composition comprised of a polymer obtained from an aliphatic amino group-containing monomer as a comonomer

HITACHI CHEMICAL CO LTD14 citations71