Inventor
YOU SHI
US7 patents
Patents
7 patentsUS11164780B2Nov 2, 2021
Process integration approach for selective metal via fill
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Method of dielectric material fill and treatment
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US12046508B2Jul 23, 2024
Method of dielectric material fill and treatment
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US11615984B2Mar 28, 2023
Method of dielectric material fill and treatment
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US11923244B2Mar 5, 2024
Subtractive metals and subtractive metal semiconductor structures
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US11515200B2Nov 29, 2022
Selective tungsten deposition within trench structures
APPLIED MATERIALS INC0 citations61
US11094588B2Aug 17, 2021
Interconnection structure of selective deposition process
APPLIED MATERIALS INC0 citations61