Inventor

BRANDENBURG SCOTT D

US61 patents

⚠️ This page may combine multiple inventors who share the name “BRANDENBURG SCOTT D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BRANDENBURG SCOTT D

DELPHI TECH INC

Electronic package and method of cooling electronics

Overmolded electronic package including circuit-carrying substrate

Method for forming an electronic assembly

Method of producing an overmolded electronic module with a flexible circuit pigtail

Electronic assembly with solder-bonded heat sink

Electrical pin interconnection for electronic package

Fluid circulator for fluid cooled electronic device

Fluid cooled encapsulated microelectronic package

Heat sink electronic package having compliant pedestal

Fluid cooled encapsulated microelectronic package

Mutli-chip module

Lead-based solder alloys containing copper

Overmolded circuit board with underfilled surface-mount component and method therefor

Wrap-around overmold for electronic assembly

Method of developing an electronic module

Fluid cooled encapsulated microelectronic package

Liquid metal rotary connector apparatus for a vehicle steering wheel and column

Circuit assembly with surface-mount IC package and heat sink

Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels

Cooled electronic assembly and method for cooling a printed circuit board

Technique for manufacturing an overmolded electronic assembly

Solder process and solder alloy therefor

Integrated circuit assembly with bar bond attachment

Edge seal for electronics assembly suitable for exposure to electrically conductive coolant

Technique for connector to printed circuit board decoupling to eliminate flexure

Polymer encapsulated electrical devices

Solderless electrical interconnection for electronic package

Printed circuit board assembly with integrated connector

Navigation system that displays other-vehicle information

Method of overmolding an electronic assembly having an insert-molded vertical mount connector header

Compression connection for vertical IC packages

Wafer applied thermally conductive interposer

Solder process and solder alloy therefor

Methods to provide and expose a diagnostic connector on overmolded electronic packages

APTIV TECH LTD

Apparatus, method and system comprising an air waveguide antenna having a single layer material with air channels therein which is interfaced with a circuit board

Plastic air-waveguide antenna with conductive particles

Liquid cooled module with device heat spreader

Interface layer with mesh and sinter paste

Electrical-circuit assembly with heat-sink

Liquid cooled module with device heat spreader

Waveguide antenna with integrated temperature management

Thermal interface layer for electronic device

Waveguide antenna with integrated temperature management

BRANDENBURG SCOTT D

Fluid cooled encapsulated microelectronic package

Liquid cooled electronics assembly suitable to use electrically conductive coolant

Assembly for liquid cooling electronics by direct submersion into circulated engine coolant

Self circulating heat exchanger

DELCO ELECTRONICS CORP

Reduced stress terminal pattern for integrated circuit devices and packages

Flexible capacitor filter

Aptiv Technologies AG

Formed waveguide antennas of a radar assembly