Inventor

REN HE

US65 patents

⚠️ This page may combine multiple inventors who share the name “REN HE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

REN HE

APPLIED MATERIALS INC

Dry-etch selectivity

Dry-etch selectivity

Process for etching metal using a combination of plasma and solid state sources

Self-aligned interconnects formed using substractive techniques

Methods for etching a structure for semiconductor applications

Seam-healing method upon supra-atmospheric process in diffusion promoting ambient

Methods of forming metal silicide layers and metal silicide layers formed therefrom

Seam-healing method upon supra-atmospheric process in diffusion promoting ambient

Integrated metal spacer and air gap interconnect

Methods for forming interconnect structure utilizing selective protection process for hardmask removal process

Aluminum nitride barrier layer

Process integration approach of selective tungsten via fill

Fully aligned subtractive processes and electronic devices therefrom

Methods for manufacturing an interconnect structure for semiconductor devices

Self-aligned interconnects formed using subtractive techniques

Dielectric/metal barrier integration to prevent copper diffusion

Methods for forming interconnection structures in an integrated cluster system for semicondcutor applications

Integrated metal spacer and air gap interconnect

Process integration approach for selective metal via fill

Process integration approach of selective tungsten via fill

Process integration method to tune resistivity of nickel silicide

Methods for depositing dielectric barrier layers and aluminum containing etch stop layers

Dielectric/metal barrier integration to prevent copper diffusion

Methods for forming passivation protection for an interconnection structure

Fully aligned subtractive processes and electronic devices therefrom

Methods and apparatuses for forming interconnection structures

Method of dielectric material fill and treatment

Method of dielectric material fill and treatment

Reverse selective etch stop layer

Methods and devices for subtractive self-alignment

Method of dielectric material fill and treatment

Damage free metal conductor formation

Methods and devices for subtractive self-alignment

Damage free metal conductor formation

Microwave anneal to improve CVD metal gap-fill and throughput

Methods for etching a dielectric barrier layer in a dual damascene structure

Subtractive metals and subtractive metal semiconductor structures

Method of cleaning a structure and method of depositing a capping layer in a structure

Multi-step pre-clean for selective metal gap fill

Selective tungsten deposition within trench structures

Multi-step pre-clean for selective metal gap fill

Interconnection structure of selective deposition process

Method for forming a metal gapfill

Methods and apparatus for forming backside power rails

Methods and apparatus for processing a substrate

MICROMATERIALS LLC

Selective removal process to create high aspect ratio fully self-aligned via

Methods for controllable metal and barrier-liner recess

Methods for controllable metal and barrier-liner recess

Selective removal process to create high aspect ratio fully self-aligned via

Fully self-aligned via