Inventor
NOYAN ISMAIL CEVDET
US10 patents
⚠️ This page may combine multiple inventors who share the name “NOYAN ISMAIL CEVDET”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
9 patentsUS6029199AFeb 22, 2000
Computing system having a system supervisor and a collection of computing subunits each of which has a subunit supervisor
IBM35 citations87
US5675884AOct 14, 1997
Apparatus for multilayer conductor chip packaging
IBM6 citations72
US5669437ASep 23, 1997
High efficiency thermal interposer
IBM9 citations72
US5847926ADec 8, 1998
Lightweight packaging
IBM11 citations71
US6503641B2Jan 7, 2003
Interconnects with Ti-containing liners
IBM5 citations62
US6211042B1Apr 3, 2001
Growth of epitaxial semiconductor films in presence of reactive metal
IBM6 citations61
US5915462AJun 29, 1999
High efficiency thermal interposer
IBM5 citations61
US6734363B1May 11, 2004
Lightweight electronic equipment conductor with coolant permeable support
IBM6 citations60
US6017401AJan 25, 2000
Conductivity improvement in thin films of refractory metal
IBM0 citations51