Inventor · disambiguated record
John Coronati
Also filed as: CORONATI JOHN · CORONATI JOHN M · CORONATI JOHN MICHAEL
8 granted patents·4 pending applications·28 citations·filing 1998–2025
79Inventor score
Top patents by PatentIndex Score
12 records- 0167US10962296B2Low-cost nano-heat pipeINFINERA CORP·Filed 2019·Granted Mar 30, 2021·1 cites·7 claims
- 0267US2025219310A1Ultra-dense, low-profile edge card connectorSAMTEC INC·Filed 2025·Application pending·0 cites
- 0357US12278441B2Ultra-dense, low-profile edge card connectorSAMTEC INC·Filed 2019·Granted Apr 15, 2025·0 cites·17 claims
- 0456US6198166B1Power semiconductor mounting package containing ball grid arrayINTERSIL CORP·Filed 1999·Granted Mar 6, 2001·25 cites·10 claims
- 0554US2025054929A1Optical engine for high-speed data transmissionSAMTEC INC·Filed 2022·Application pending·0 cites
- 0652US11409063B2Optical interposerSAMTEC INC·Filed 2019·Granted Aug 9, 2022·0 cites·28 claims
- 0747US2024170303A1Interconnect alignment system and methodSAMTEC INC·Filed 2022·Application pending·0 cites
- 0845US9711879B2Clamp interconnectINFINERA CORP·Filed 2014·Granted Jul 18, 2017·0 cites·23 claims
- 0944US10175005B2Low-cost nano-heat pipeINFINERA CORP·Filed 2015·Granted Jan 8, 2019·0 cites·13 claims
- 1033US2006006526A1Thermal interposer for cooled electrical packagesCORONATI JOHN M·Filed 2004·Application pending·0 cites
- 1130US6069403APower module with lowered inductance and reduced voltage overshootsINTERSIL CORP·Filed 1998·Granted May 30, 2000·2 cites·23 claims
- 1228US6140152APower module with lowered inductance and reduced voltage overshootsINTERSIL CORP·Filed 1999·Granted Oct 31, 2000·0 cites·19 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →