Inventor
LIANG JINGMEI
US39 patents
⚠️ This page may combine multiple inventors who share the name “LIANG JINGMEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
28 patentsUS7803722B2Sep 28, 2010
Methods for forming a dielectric layer within trenches
APPLIED MATERIALS INC573 citations99
US9412581B2Aug 9, 2016
Low-K dielectric gapfill by flowable deposition
APPLIED MATERIALS INC396 citations98
US7935643B2May 3, 2011
Stress management for tensile films
APPLIED MATERIALS INC48 citations94
US9570287B2Feb 14, 2017
Flowable film curing penetration depth improvement and stress tuning
APPLIED MATERIALS INC7 citations84
US8889566B2Nov 18, 2014
Low cost flowable dielectric films
APPLIED MATERIALS INC9 citations83
US8975152B2Mar 10, 2015
Methods of reducing substrate dislocation during gapfill processing
APPLIED MATERIALS INC5 citations73
US11170994B1Nov 9, 2021
CD dependent gap fill and conformal films
APPLIED MATERIALS INC3 citations72
US9018108B2Apr 28, 2015
Low shrinkage dielectric films
APPLIED MATERIALS INC6 citations71
US12543547B2Feb 3, 2026
Method of dielectric material fill and treatment
APPLIED MATERIALS INC0 citations62
US12046508B2Jul 23, 2024
Method of dielectric material fill and treatment
APPLIED MATERIALS INC0 citations62
US11804372B2Oct 31, 2023
CD dependent gap fill and conformal films
APPLIED MATERIALS INC0 citations62
US11615984B2Mar 28, 2023
Method of dielectric material fill and treatment
APPLIED MATERIALS INC0 citations62
US11469100B2Oct 11, 2022
Methods of post treating dielectric films with microwave radiation
APPLIED MATERIALS INC0 citations62
US11367614B2Jun 21, 2022
Surface roughness for flowable CVD film
APPLIED MATERIALS INC0 citations62
US11152248B2Oct 19, 2021
Cyclic flowable deposition and high-density plasma treatment processes for high quality gap fill solutions
APPLIED MATERIALS INC1 citations62
US11133177B2Sep 28, 2021
Oxidation reduction for SiOC film
APPLIED MATERIALS INC1 citations62
US11090683B2Aug 17, 2021
Cure method for cross-linking Si-hydroxyl bonds
APPLIED MATERIALS INC0 citations62
US10707116B2Jul 7, 2020
Cyclic flowable deposition and high-density plasma treatment processes for high quality gap fill solutions
APPLIED MATERIALS INC1 citations62
US11170990B2Nov 9, 2021
Polysilicon liners
APPLIED MATERIALS INC0 citations61
US12230499B2Feb 18, 2025
Methods of post treating silicon nitride based dielectric films with high energy low dose plasma
APPLIED MATERIALS INC0 citations59
US11967524B2Apr 23, 2024
3D NAND gate stack reinforcement
APPLIED MATERIALS INC0 citations59
US10934620B2Mar 2, 2021
Integration of dual remote plasmas sources for flowable CVD
APPLIED MATERIALS INC0 citations51
US10041167B2Aug 7, 2018
Cyclic sequential processes for forming high quality thin films
APPLIED MATERIALS INC1 citations51
US12374584B2Jul 29, 2025
Multi color stack for self aligned dual pattern formation for multi purpose device structures
APPLIED MATERIALS INC0 citations50
US12334337B2Jun 17, 2025
Integrated flowable low-k gap-fill and plasma treatment
APPLIED MATERIALS INC0 citations50
US11107674B2Aug 31, 2021
Methods for depositing silicon nitride
APPLIED MATERIALS INC0 citations50
US12094709B2Sep 17, 2024
Plasma treatment process to densify oxide layers
APPLIED MATERIALS INC0 citations47
US9896326B2Feb 20, 2018
FCVD line bending resolution by deposition modulation
APPLIED MATERIALS INC0 citations41
LIANG JINGMEI
10 patentsUS8741788B2Jun 3, 2014
Formation of silicon oxide using non-carbon flowable CVD processes
LIANG JINGMEI61 citations98
US8551891B2Oct 8, 2013
Remote plasma burn-in
LIANG JINGMEI167 citations98
US8449942B2May 28, 2013
Methods of curing non-carbon flowable CVD films
LIANG JINGMEI70 citations97
US8647992B2Feb 11, 2014
Flowable dielectric using oxide liner
LIANG JINGMEI41 citations94
US8563445B2Oct 22, 2013
Conformal layers by radical-component CVD
LIANG JINGMEI49 citations94
US8629067B2Jan 14, 2014
Dielectric film growth with radicals produced using flexible nitrogen/hydrogen ratio
LIANG JINGMEI11 citations84
US8466067B2Jun 18, 2013
Post-planarization densification
LIANG JINGMEI19 citations84
US8329587B2Dec 11, 2012
Post-planarization densification
LIANG JINGMEI15 citations84
US8445078B2May 21, 2013
Low temperature silicon oxide conversion
LIANG JINGMEI19 citations83
US9404178B2Aug 2, 2016
Surface treatment and deposition for reduced outgassing
LIANG JINGMEI4 citations73