Inventor
TUCKER SEAN W
US13 patents
⚠️ This page may combine multiple inventors who share the name “TUCKER SEAN W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD DEVELOPMENT CO
8 patentsUS7061761B2Jun 13, 2006
System and method for cooling components in an electronic device
HEWLETT PACKARD DEVELOPMENT CO64 citations98
US6625014B1Sep 23, 2003
System and method for situating a disk drive
HEWLETT PACKARD DEVELOPMENT CO86 citations97
US6644481B2Nov 11, 2003
Apparatus and method for rackmounting a chassis
HEWLETT PACKARD DEVELOPMENT CO57 citations95
US7055701B2Jun 6, 2006
Apparatus and method for rackmounting a chassis
HEWLETT PACKARD DEVELOPMENT CO18 citations92
US6906915B2Jun 14, 2005
Chassis system that permits installation of media devices in selected orientations
HEWLETT PACKARD DEVELOPMENT CO12 citations83
US7090528B2Aug 15, 2006
System and method for stabilizing a mating
HEWLETT PACKARD DEVELOPMENT CO14 citations82
US6789685B2Sep 14, 2004
Apparatus and method for rackmounting a chassis
HEWLETT PACKARD DEVELOPMENT CO5 citations73
US10620716B2Apr 14, 2020
Visibly opaque and near infrared transparent display border with underlying encoded pattern
HEWLETT PACKARD DEVELOPMENT CO1 citations60
HEWLETT PACKARD CO
5 patentsUS6362977B1Mar 26, 2002
EMI containment assembly for an integrated circuit chip
HEWLETT PACKARD CO33 citations92
US6295202B1Sep 25, 2001
Heatsink for actively cooled daughterboard system
HEWLETT PACKARD CO41 citations90
US6327148B1Dec 4, 2001
Heatsink for actively cooled daughterboard system
HEWLETT PACKARD CO16 citations82
US6304442B1Oct 16, 2001
Actively cooled daughterboard system
HEWLETT PACKARD CO15 citations82
US6039241AMar 21, 2000
Mechanism for removal of surface mount connectors using heat conduction through pins
HEWLETT PACKARD CO6 citations64