Inventor
CHIN BARRY
US22 patents
Patents
22 patentsUS6328871B1Dec 11, 2001
Barrier layer for electroplating processes
APPLIED MATERIALS INC161 citations99
US6287977B1Sep 11, 2001
Method and apparatus for forming improved metal interconnects
APPLIED MATERIALS INC161 citations99
US6066892AMay 23, 2000
Copper alloy seed layer for copper metallization in an integrated circuit
APPLIED MATERIALS INC185 citations99
US6037257AMar 14, 2000
Sputter deposition and annealing of copper alloy metallization
APPLIED MATERIALS INC117 citations99
US6436267B1Aug 20, 2002
Method for achieving copper fill of high aspect ratio interconnect features
APPLIED MATERIALS INC105 citations98
US6992012B2Jan 31, 2006
Method and apparatus for forming improved metal interconnects
APPLIED MATERIALS INC35 citations96
US6709987B2Mar 23, 2004
Method and apparatus for forming improved metal interconnects
APPLIED MATERIALS INC55 citations96
US6620956B2Sep 16, 2003
Nitrogen analogs of copper II β-diketonates as source reagents for semiconductor processing
APPLIED MATERIALS INC69 citations96
US6566259B1May 20, 2003
Integrated deposition process for copper metallization
APPLIED MATERIALS INC41 citations96
US6559061B2May 6, 2003
Method and apparatus for forming improved metal interconnects
APPLIED MATERIALS INC63 citations96
US6399479B1Jun 4, 2002
Processes to improve electroplating fill
APPLIED MATERIALS INC74 citations96
US6387805B2May 14, 2002
Copper alloy seed layer for copper metallization
APPLIED MATERIALS INC58 citations96
US6160315ADec 12, 2000
Copper alloy via structure
APPLIED MATERIALS INC73 citations96
US6174811B1Jan 16, 2001
Integrated deposition process for copper metallization
APPLIED MATERIALS INC48 citations94
US6458255B2Oct 1, 2002
Ultra-low resistivity tantalum films and methods for their deposition
APPLIED MATERIALS INC32 citations93
US6235163B1May 22, 2001
Methods and apparatus for ionized metal plasma copper deposition with enhanced in-film particle performance
APPLIED MATERIALS INC54 citations93
US6790776B2Sep 14, 2004
Barrier layer for electroplating processes
APPLIED MATERIALS INC34 citations92
US6313033B1Nov 6, 2001
Ionized metal plasma Ta, TaNx, W, and WNx liners for gate electrode applications
APPLIED MATERIALS INC33 citations92
US6200433B1Mar 13, 2001
IMP technology with heavy gas sputtering
APPLIED MATERIALS INC45 citations92
US6140235AOct 31, 2000
High pressure copper fill at low temperature
APPLIED MATERIALS INC29 citations92
US6458251B1Oct 1, 2002
Pressure modulation method to obtain improved step coverage of seed layer
APPLIED MATERIALS INC28 citations89
US6881673B2Apr 19, 2005
Integrated deposition process for copper metallization
APPLIED MATERIALS INC8 citations74