Inventor
SUN BINGXI
US9 patents
Patents
9 patentsUS6066892AMay 23, 2000
Copper alloy seed layer for copper metallization in an integrated circuit
APPLIED MATERIALS INC185 citations99
US6037257AMar 14, 2000
Sputter deposition and annealing of copper alloy metallization
APPLIED MATERIALS INC117 citations99
US6566259B1May 20, 2003
Integrated deposition process for copper metallization
APPLIED MATERIALS INC41 citations96
US6387805B2May 14, 2002
Copper alloy seed layer for copper metallization
APPLIED MATERIALS INC58 citations96
US6160315ADec 12, 2000
Copper alloy via structure
APPLIED MATERIALS INC73 citations96
US6488823B1Dec 3, 2002
Stress tunable tantalum and tantalum nitride films
APPLIED MATERIALS INC30 citations92
US6313033B1Nov 6, 2001
Ionized metal plasma Ta, TaNx, W, and WNx liners for gate electrode applications
APPLIED MATERIALS INC33 citations92
US6217715B1Apr 17, 2001
Coating of vacuum chambers to reduce pump down time and base pressure
APPLIED MATERIALS INC31 citations92
US6881673B2Apr 19, 2005
Integrated deposition process for copper metallization
APPLIED MATERIALS INC8 citations74