Inventor

AKIYAMA SHOJI

JP137 patents

⚠️ This page may combine multiple inventors who share the name “AKIYAMA SHOJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

AKIYAMA SHOJI

SHINETSU HANDOTAI KK

Method for fabrication of thin film

Method of producing a bonded wafer and the bonded wafer

Production method for silicon wafer and silicon wafer

Method for heat-treating silicon wafer and silicon wafer

Method for thermally annealing silicon wafer and silicon wafer

Method for producing silicon single crystal wafer and silicon single crystal wafer

SOI wafers and methods for producing SOI wafer

Method for heat treatment of silicon wafer and silicon wafer

Method for manufacturing annealed wafer and annealed wafer

Method for heat treatment of silicon wafers and silicon wafer

Method for fabricating silicon thin film

SHINETSU CHEMICAL CO

Method for preparing substrate having monocrystalline film

Method for manufacturing semiconductor substrate

Pellicle and method for producing pellicle

Optical waveguide apparatus and method for manufacturing the same

Pellicle and method for manufacturing the same

Method for producing composite wafer having oxide single-crystal film

Method for producing composite wafer having oxide single-crystal film

SiC composite substrate and method for manufacturing same

Method for manufacturing composite wafer provided with oxide single crystal thin film

Method for manufacturing SiC composite substrate, and method for manufacturing semiconductor substrate

Pellicle for EUV

ZEXEL CORP

Tube for heat exchangers and method of manufacturing same

Heat exchanger

Heat exchanger and method of producing the same

Tube for heat exchangers and method of manufacturing the same

Heat exchanger

Brazing method

SONY CORP

Chip device and a particle analyzing apparatus

Disk tray used with an apparatus for forming a protective film on an optical disk

Micro flow channel chip

Micro flow channel chip

Micro flow channel chip for a flow cytometer

AKIYAMA SHOJI

Method for manufacturing bonded wafer

SOS substrate with reduced stress

Pellicle for lithography and manufacturing method thereof

Method for manufacturing bonded substrate with sandblast treatment

Method for manufacturing composite substrate comprising wide bandgap semiconductor layer

MASSACHUSETTS INST TECHNOLOGY

Optical waveguides with trench structures

Silicon based on-chip photonic band gap cladding waveguide

Process for fabrication of high reflectors by reversal of layer sequence and application thereof

Photonic bandgap modulator, amplifier, demux, and TDM devices

ZEXEL VALEO CLIMATE CONTR CORP

Heat exchanger

Heat exchanger, method of manufacturing the heat exchanger, and method of manufacturing tube for heat exchange

AKIYAMA YUJI

Micro flow channel chip for flow cytometer

Microchip and particle analyzing apparatus

SHIN ETSU HANDOTAL CO LTD

Method of producing a bonded wafer and the bonded wafer

VALEO THERMAL SYS JAPAN CO

Tube for heat exchanger

ITO TATSUMI

Microchip and particulate analyzing device

SHINODA MASATAKA

Microparticle sorting apparatus, microchip and microchip module