Inventor

KANG SIN-WOO

KR8 patents

⚠️ This page may combine multiple inventors who share the name “KANG SIN-WOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

5 patents

US8841754B2Sep 23, 2014

Semiconductor devices with stress relief layers

SAMSUNG ELECTRONICS CO LTD8 citations80

US9559002B2Jan 31, 2017

Methods of fabricating semiconductor devices with blocking layer patterns

SAMSUNG ELECTRONICS CO LTD4 citations71

US8890282B2Nov 18, 2014

Integrated circuit devices including through-silicon via (TSV) contact pads electronically insulated from a substrate

SAMSUNG ELECTRONICS CO LTD6 citations71

US9147640B2Sep 29, 2015

Semiconductor devices having back side bonding structures

SAMSUNG ELECTRONICS CO LTD3 citations60

US9418915B2Aug 16, 2016

Semiconductor device and method for fabricating the same

SAMSUNG ELECTRONICS CO LTD1 citations50

LEE HO-JIN

1 patent

US8592988B2Nov 26, 2013

Semiconductor device

LEE HO-JIN19 citations91

YUN KI-YOUNG

1 patent

US8836109B2Sep 16, 2014

Semiconductor device and method of manufacturing a semiconductor device

YUN KI-YOUNG9 citations77

PARK YEONG-LYEOL

1 patent

US8729684B2May 20, 2014

Interposer chip, multi-chip package including the interposer chip, and method of manufacturing the same

PARK YEONG-LYEOL1 citations44