Inventor

XU YANBO

CN6 patents

⚠️ This page may combine multiple inventors who share the name “XU YANBO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WANG ZHIJIE

2 patents

US9252114B2Feb 2, 2016

Semiconductor device grid array package

WANG ZHIJIE0 citations46

US9214413B2Dec 15, 2015

Semiconductor die package with pre-molded die

WANG ZHIJIE0 citations36

FREESCALE SEMICONDUCTOR INC

1 patent

US9362212B1Jun 7, 2016

Integrated circuit package having side and bottom contact pads

FREESCALE SEMICONDUCTOR INC3 citations69

XU YANBO

1 patent

US9613941B2Apr 4, 2017

Exposed die power semiconductor device

XU YANBO2 citations63

BI JIANSHE

1 patent

US9196557B1Nov 24, 2015

Protective packaging for integrated circuit device

BI JIANSHE1 citations39

CHEN QUAN

1 patent

US8652384B2Feb 18, 2014

Method for molding semiconductor device

CHEN QUAN0 citations34