Inventor

ZONG FEI

CN5 patents

⚠️ This page may combine multiple inventors who share the name “ZONG FEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WANG ZHIJIE

2 patents

US9252114B2Feb 2, 2016

Semiconductor device grid array package

WANG ZHIJIE0 citations46

US9214413B2Dec 15, 2015

Semiconductor die package with pre-molded die

WANG ZHIJIE0 citations36

FREESCALE SEMICONDUCTOR INC

1 patent

US9362212B1Jun 7, 2016

Integrated circuit package having side and bottom contact pads

FREESCALE SEMICONDUCTOR INC3 citations69

XU YANBO

1 patent

US9613941B2Apr 4, 2017

Exposed die power semiconductor device

XU YANBO2 citations63

ZONG FEI

1 patent

US8496158B2Jul 30, 2013

Method and apparatus for monitoring free air ball (FAB) formation in wire bonding

ZONG FEI3 citations51