Inventor
LEE NA EIN
KR3 patents
Patents
3 patentsUS10639875B2May 5, 2020
Wafer bonding apparatus and wafer bonding system including the same
SAMSUNG ELECTRONICS CO LTD6 citations72
US9812353B2Nov 7, 2017
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US9984921B2May 29, 2018
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations51