Inventor
SU BINGZHI
US5 patents
⚠️ This page may combine multiple inventors who share the name “SU BINGZHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMICONDUCTOR COMPONENTS IND LLC
4 patentsUS9754983B1Sep 5, 2017
Chip scale package and related methods
SEMICONDUCTOR COMPONENTS IND LLC6 citations82
US10079254B2Sep 18, 2018
Chip scale package and related methods
SEMICONDUCTOR COMPONENTS IND LLC1 citations61
US11075306B2Jul 27, 2021
Filled through silicon vias for semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations57
US10770492B2Sep 8, 2020
Chip scale package and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations50