Inventor
KUWAKO FUJIO
JP12 patents
⚠️ This page may combine multiple inventors who share the name “KUWAKO FUJIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUI MINING & SMELTING CO
10 patentsUS6240636B1Jun 5, 2001
Method for producing vias in the manufacture of printed circuit boards
MITSUI MINING & SMELTING CO91 citations97
US6693793B2Feb 17, 2004
Double-sided copper clad laminate for capacitor layer formation and its manufacturing method
MITSUI MINING & SMELTING CO50 citations95
US6107003AAug 22, 2000
Method for producing multi-layer printed wiring boards having blind vias
MITSUI MINING & SMELTING CO36 citations91
US6884944B1Apr 26, 2005
Multi-layer printed wiring boards having blind vias
MITSUI MINING & SMELTING CO14 citations82
US6905757B2Jun 14, 2005
Dielectric filler containing resin for use in formation of built-in capacitor layer of printed wiring board and double-sided copper clad laminate with dielectric layer formed using the same dielectric filler containing resin, and production method of double-sided copper clad laminate
MITSUI MINING & SMELTING CO15 citations81
US6551433B2Apr 22, 2003
Method for producing copper-clad laminate
MITSUI MINING & SMELTING CO9 citations71
US10524360B2Dec 31, 2019
Copper clad laminate for forming of embedded capacitor layer, multilayered printed wiring board, and manufacturing method of multilayered printed wiring board
MITSUI MINING & SMELTING CO0 citations50
US9924597B2Mar 20, 2018
Copper clad laminate for forming of embedded capacitor layer, multilayered printed wiring board, and manufacturing method of multilayered printed wiring board
MITSUI MINING & SMELTING CO0 citations50
US10863621B2Dec 8, 2020
Metal foil with releasing resin layer, and printed wiring board
MITSUI MINING & SMELTING CO0 citations48
US10244640B2Mar 26, 2019
Copper clad laminate provided with protective layer and multilayered printed wiring board
MITSUI MINING & SMELTING CO0 citations39