Inventor
MOON SEOK-HWAN
KR18 patents
⚠️ This page may combine multiple inventors who share the name “MOON SEOK-HWAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KOREA ELECTRONICS TELECOMM
7 patentsUS6619384B2Sep 16, 2003
Heat pipe having woven-wire wick and straight-wire wick
KOREA ELECTRONICS TELECOMM43 citations89
US9337121B2May 10, 2016
Semiconductor device and method of fabricating the same
KOREA ELECTRONICS TELECOMM4 citations71
US7971633B2Jul 5, 2011
Loop type micro heat transport device
KOREA ELECTRONICS TELECOMM6 citations62
US9024511B2May 5, 2015
Impact-type piezoelectric micro power generator
KOREA ELECTRONICS TELECOMM0 citations52
US9296205B2Mar 29, 2016
Active cliche for large-area printing, manufacturing method of the same, and printing method using the same
KOREA ELECTRONICS TELECOMM0 citations51
US9085140B2Jul 21, 2015
Active cliche for large-area printing, manufacturing method of the same, and printing method using the same
KOREA ELECTRONICS TELECOMM0 citations51
US9159583B2Oct 13, 2015
Methods of manufacturing nitride semiconductor devices
KOREA ELECTRONICS TELECOMM1 citations50
ELECTRONICS & TELECOMMUNICATIONS RES INST
7 patentsUS10020201B2Jul 10, 2018
Semiconductor device and method of fabricating the same
ELECTRONICS & TELECOMMUNICATIONS RES INST2 citations71
US10636761B2Apr 28, 2020
Method of fabricating a semiconductor package
ELECTRONICS & TELECOMMUNICATIONS RES INST6 citations66
US12457833B2Oct 28, 2025
Electronic device and its repair method
ELECTRONICS & TELECOMMUNICATIONS RES INST0 citations61
US12349505B2Jul 1, 2025
Method of manufacturing electric device
ELECTRONICS & TELECOMMUNICATIONS RES INST0 citations61
US12206056B2Jan 21, 2025
Semiconductor package with intermetallic-compound solder-joint comprising solder, UBM, and reducing layer materials
ELECTRONICS & TELECOMMUNICATIONS RES INST0 citations61
US11107790B2Aug 31, 2021
Laser bonding method
ELECTRONICS & TELECOMMUNICATIONS RES INST0 citations61
US11488841B2Nov 1, 2022
Method for manufacturing semiconductor package
ELECTRONICS & TELECOMMUNICATIONS RES INST0 citations51