Inventor
LEE HSING-WEN
TW3 patents
Patents
3 patentsUS12444689B2Oct 14, 2025
Semiconductor package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations58
US11894308B2Feb 6, 2024
Semiconductor package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations58
US10854550B2Dec 1, 2020
Semiconductor package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations47