Inventor

THAI CAO M

JP4 patents

Patents

4 patents

US5536970AJul 16, 1996

Resin-encapsulated semiconductor device

TOSHIBA KK80 citations94

US5589129ADec 31, 1996

Method of manufacturing a molding using a filler or an additive concentrated on an arbitrary portion or distributed at a gradient concentration

TOSHIBA KK47 citations91

US4829134AMay 9, 1989

Epoxy resin composition

TOSHIBA KK24 citations88

US4617330AOct 14, 1986

Epoxy resin composition for cast molding

TOSHIBA KK10 citations71