Inventor
JUNG DAE Y
US5 patents
Patents
5 patentsUS4869930ASep 26, 1989
Method for preparing substrates for deposition of metal seed from an organometallic vapor for subsequent electroless metallization
IBM36 citations90
US4904506AFeb 27, 1990
Copper deposition from electroless plating bath
IBM19 citations79
US4593016AJun 3, 1986
Process for manufacturing a concentrate of a palladium-tin colloidal catalyst
IBM11 citations72
US4684545AAug 4, 1987
Electroless plating with bi-level control of dissolved oxygen
IBM14 citations70
US4967690ANov 6, 1990
Electroless plating with bi-level control of dissolved oxygen, with specific location of chemical maintenance means
IBM3 citations59