Inventor
OHNO YASUHIDE
JP11 patents
⚠️ This page may combine multiple inventors who share the name “OHNO YASUHIDE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NIPPON STEEL CORP
7 patentsUS5227662AJul 13, 1993
Composite lead frame and semiconductor device using the same
NIPPON STEEL CORP150 citations95
US4379482AApr 12, 1983
Prevention of cracking of continuously cast steel slabs containing boron
NIPPON STEEL CORP35 citations91
US5761779AJun 9, 1998
Method of producing fine metal spheres of uniform size
NIPPON STEEL CORP31 citations89
US5164336ANov 17, 1992
Method of connecting tab tape to semiconductor chip, and bump sheet and bumped tape used in the method
NIPPON STEEL CORP23 citations89
US5658664AAug 19, 1997
Thin gold-alloy wire for semiconductor device
NIPPON STEEL CORP9 citations73
US5114878AMay 19, 1992
Method of bonding bumps to leads of tab tape and an apparatus for arranging bumps used for the same
NIPPON STEEL CORP6 citations60
US5491034AFeb 13, 1996
Bonding wire for semiconductor element
NIPPON STEEL CORP2 citations59
JAPAN SCIENCE & TECH AGENCY
3 patentsUS9240561B2Jan 19, 2016
Nanodevice and method for fabricating the same
JAPAN SCIENCE & TECH AGENCY2 citations56
US7964066B2Jun 21, 2011
Method for controlling structure of nano-scale substance, and method for preparing low dimensional quantum structure having nano-scale using the method for controlling structure
JAPAN SCIENCE & TECH AGENCY0 citations39
US9825161B2Nov 21, 2017
Logical operation element
JAPAN SCIENCE & TECH AGENCY0 citations32