Inventor

TEO YEOW MENG

SG18 patents

⚠️ This page may combine multiple inventors who share the name “TEO YEOW MENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TEO YEOW MENG

LUMILEDS LLC

Flip chip LED with side reflectors and phosphor

Contact etching and metallization for improved LED device performance and reliability

Light emitting diode devices with defined hard mask opening

Light emitting diode devices with defined hard mask opening

Methods of making flip chip micro light emitting diodes

Methods of making flip chip micro light emitting diodes

Flip chip LED with side reflectors encasing side surfaces of a semiconductor structure and phosphor

Flip chip micro light emitting diodes

Light emitting diode devices with bonding and/or ohmic contact-reflective material

Light emitting diode devices with bonding and/or ohmic contact-reflective material

CHARTERED SEMICONDUCTOR MFG

Method for forming contacts and vias with improved barrier metal step-coverage

Stacked container capacitor using chemical mechanical polishing

Method for forming stacked polysilicon

Method using ultraviolet radiation for integrated circuit manufacturing

Method of fabricating an antifuse element

Method of forming top metal contact to antifuse

CHARTERED SEMICONDUCTOR MAUFAC

Method of forming salicided poly to metal capacitor

CHONG DAVID

Contact etching and metallization for improved LED device performance and reliability