Inventor
LANE RYAN
US9 patents
⚠️ This page may combine multiple inventors who share the name “LANE RYAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QUALCOMM INC
7 patentsUS6762495B1Jul 13, 2004
Area array package with non-electrically connected solder balls
QUALCOMM INC98 citations93
US11452246B2Sep 20, 2022
Patch substrate configured as a shield located over a cavity of a board
QUALCOMM INC5 citations69
US11605594B2Mar 14, 2023
Package comprising a substrate and a high-density interconnect integrated device coupled to the substrate
QUALCOMM INC0 citations56
US6891275B2May 10, 2005
Method for accommodating small minimum die in wire bonded area array packages
QUALCOMM INC5 citations56
US7612449B2Nov 3, 2009
Optimized power delivery to high speed, high pin-count devices
QUALCOMM INC4 citations55
US11784157B2Oct 10, 2023
Package comprising integrated devices coupled through a metallization layer
QUALCOMM INC0 citations50
US12160952B2Dec 3, 2024
Providing a lower inductance path in a routing substrate for a capacitor, and related electronic devices and fabrication methods
QUALCOMM INC0 citations49