Inventor
LIN YUNG-SHENG
TW43 patents
⚠️ This page may combine multiple inventors who share the name “LIN YUNG-SHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
15 patentsUS12015002B2Jun 18, 2024
Chip structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US12543552B2Feb 3, 2026
Semiconductor device structure with conductive bumps
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12463166B2Nov 4, 2025
Chip structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12412858B2Sep 9, 2025
Semiconductor device structure with conductive bumps
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11990440B2May 21, 2024
Structure and formation method of semiconductor device with conductive bumps
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11854964B2Dec 26, 2023
Structure and formation method of semiconductor device with conductive bumps
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12438048B2Oct 7, 2025
Redistribution lines with protection layers and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12009256B2Jun 11, 2024
Redistribution lines with protection layers and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11721579B2Aug 8, 2023
Redistribution lines with protection layers and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11387143B2Jul 12, 2022
Redistribution lines with protection layers and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US12500149B2Dec 16, 2025
Semiconductor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12431365B2Sep 30, 2025
Bump structure and method of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12033870B2Jul 9, 2024
Bump structure and method of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11769716B2Sep 26, 2023
Semiconductor device and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11417539B2Aug 16, 2022
Bump structure and method of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
CHANG CHUN PLASTICS CO LTD
6 patentsUS10450478B1Oct 22, 2019
Epoxy resin, aqueous dispersion and water-borne epoxy coating composition comprising the same
CHANG CHUN PLASTICS CO LTD8 citations79
US10392504B2Aug 27, 2019
Reactive epoxy compounds and method for producing the same, core-shell type epoxy resin particles, waterborne epoxy resin composition, and coating composition containing the reactive epoxy compounds
CHANG CHUN PLASTICS CO LTD1 citations58
US11065724B1Jul 20, 2021
Laser weldable compositions, products and uses thereof
CHANG CHUN PLASTICS CO LTD0 citations57
US10246607B2Apr 2, 2019
Resin composition, coating composition and article by using the same
CHANG CHUN PLASTICS CO LTD0 citations48
US10745556B1Aug 18, 2020
Amino resin composition and varnish, coating layer, and product comprising the same
CHANG CHUN PLASTICS CO LTD0 citations44
US11180607B2Nov 23, 2021
Polyesters with ultra-high flowability and superior stability and meltblown fibers thereof
CHANG CHUN PLASTICS CO LTD0 citations39
DELL PRODUCTS LP
6 patentsUS11994787B2May 28, 2024
Method and apparatus for closed-loop camera shutter control and remediation hardware
DELL PRODUCTS LP2 citations72
US12333314B2Jun 17, 2025
Systems and methods for configuration of a workspace based on short-range wireless location mapping in heterogeneous computing platforms
DELL PRODUCTS LP0 citations62
US11669639B2Jun 6, 2023
System and method for multi-user state change
DELL PRODUCTS LP1 citations62
US12566472B2Mar 3, 2026
Systems and methods for managing settings based upon information handling system (IHS) posture and orientation using heterogeneous computing platforms
DELL PRODUCTS LP0 citations52
US12141519B2Nov 12, 2024
Systems and methods for managing text settings based upon user distance with heterogeneous computing platforms
DELL PRODUCTS LP0 citations51
US12547783B2Feb 10, 2026
Privacy threat detection with extended field of view
DELL PRODUCTS LP0 citations44
ADVANCED SEMICONDUCTOR ENG
4 patentsUS11257776B2Feb 22, 2022
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations62
US12057670B2Aug 6, 2024
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations58
US11430761B2Aug 30, 2022
Semiconductor package and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations56
US11798907B2Oct 24, 2023
Semiconductor packages
ADVANCED SEMICONDUCTOR ENG0 citations53
LIN YUNG-SHENG
3 patentsUS8409262B2Apr 2, 2013
Composition used for increasing calmodulin and method thereof
LIN YUNG-SHENG5 citations68
US8333018B2Dec 18, 2012
Composition for enhancing evaporation of solution and method thereof
LIN YUNG-SHENG5 citations59
US9630271B1Apr 25, 2017
Welding gun with evenly distributed gas pressure
LIN YUNG-SHENG1 citations41