P

Inventor

LIN YUNG-SHENG

TW43 patents
⚠️ This page may combine multiple inventors who share the name “LIN YUNG-SHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

15 patents
US12015002B2Jun 18, 2024

Chip structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US12543552B2Feb 3, 2026

Semiconductor device structure with conductive bumps

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12463166B2Nov 4, 2025

Chip structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12412858B2Sep 9, 2025

Semiconductor device structure with conductive bumps

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11990440B2May 21, 2024

Structure and formation method of semiconductor device with conductive bumps

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11854964B2Dec 26, 2023

Structure and formation method of semiconductor device with conductive bumps

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12438048B2Oct 7, 2025

Redistribution lines with protection layers and method forming same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12009256B2Jun 11, 2024

Redistribution lines with protection layers and method forming same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11721579B2Aug 8, 2023

Redistribution lines with protection layers and method forming same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11387143B2Jul 12, 2022

Redistribution lines with protection layers and method forming same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US12500149B2Dec 16, 2025

Semiconductor device and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12431365B2Sep 30, 2025

Bump structure and method of making the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12033870B2Jul 9, 2024

Bump structure and method of making the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11769716B2Sep 26, 2023

Semiconductor device and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11417539B2Aug 16, 2022

Bump structure and method of making the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60

CHANG CHUN PLASTICS CO LTD

6 patents

DELL PRODUCTS LP

6 patents

ADVANCED SEMICONDUCTOR ENG

4 patents

LIN YUNG-SHENG

3 patents

(unassigned)

2 patents

TAIWAN THICK FILM IND CORP

1 patent

LIN YUNG SHENG

1 patent

UNIV NAT TSING HUA

1 patent

NAT APPLIED RES LABORATORIES

1 patent

MEDICAL & PHARM IND TECH & DEV

1 patent

SHIEH KUEN-WEY

1 patent

YANG CHIH-HUI

1 patent