Inventor

LEE HEE BONG

KR10 patents

⚠️ This page may combine multiple inventors who share the name “LEE HEE BONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STATS CHIPPAC LTD

2 patents

US7238258B2Jul 3, 2007

System for peeling semiconductor chips from tape

STATS CHIPPAC LTD21 citations90

US7958628B2Jun 14, 2011

Bonding tool for mounting semiconductor chips

STATS CHIPPAC LTD4 citations61

CHIPPAC INC

2 patents

US7650688B2Jan 26, 2010

Bonding tool for mounting semiconductor chips

CHIPPAC INC15 citations83

US7306971B2Dec 11, 2007

Semiconductor chip packaging method with individually placed film adhesive pieces

CHIPPAC INC1 citations51

HANA MICRON CO LTD

1 patent

US7709946B2May 4, 2010

Micro universal serial bus (USB) memory package

HANA MICRON CO LTD31 citations83

SHIN HONG SUP

1 patent

US8848596B2Sep 30, 2014

Method for controlling timing of backhaul link and relay system for the same

SHIN HONG SUP9 citations80

KIM SANG HA

1 patent

US8548514B2Oct 1, 2013

Method for resource element group downsizing of R-PDCCH and mobile telecommunication system for the same

KIM SANG HA13 citations80

SHIM HYUN GUE

1 patent

US8410597B2Apr 2, 2013

Three dimensional semiconductor device

SHIM HYUN GUE3 citations50

KIM BONG CHAN

1 patent

US8741927B2Jun 3, 2014

Production method of intermediate compound for synthesizing medicament

KIM BONG CHAN0 citations45

LEE CHANG-SEOK

1 patent

US8470836B2Jun 25, 2013

Dipeptidyl peptidase-IV inhibiting compounds, methods of preparing the same, and pharmaceutical compositions containing the same as active agent

LEE CHANG-SEOK0 citations26