Inventor · disambiguated record
Ming-Jen Hsiung
Also filed as: HSIUNG MING-JEN
3 granted patents·5 citations·filing 2016–2016
56Inventor score
Files withMEDIATEK INC3
Top patents by PatentIndex Score
3 records- 0177US9953954B2Wafer-level chip-scale package with redistribution layerMEDIATEK INC·Filed 2016·Granted Apr 24, 2018·4 cites·25 claims
- 0258US10998267B2Wafer-level chip-size package with redistribution layerMEDIATEK INC·Filed 2016·Granted May 4, 2021·1 cites·6 claims
- 0344US10242927B2Semiconductor package, semiconductor device using the same and manufacturing method thereofMEDIATEK INC·Filed 2016·Granted Mar 26, 2019·0 cites·12 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →