Inventor
BUSBY JAMES
US18 patents
Patents
18 patentsUS11493565B2Nov 8, 2022
Leakage characterization and management for electronic circuit enhancement
IBM2 citations72
US11244079B2Feb 8, 2022
Data detection mitigation in printed circuit boards
IBM2 citations72
US10595419B1Mar 17, 2020
3-D flex circuit forming
IBM3 citations70
US12207392B2Jan 21, 2025
Electronic component comprising first and second conductive traces and a void formed in an insulative layer between the first and second traces providing crosstalk reduction
IBM0 citations62
US11822707B2Nov 21, 2023
Secure ventilation through protective flexible sensors
IBM0 citations62
US10956623B2Mar 23, 2021
Enclosure with tamper respondent sensor
IBM1 citations62
US12535537B2Jan 27, 2026
Leakage characterization for electronic circuit temperature monitoring
IBM0 citations61
US11991277B2May 21, 2024
Cryptographic hardware security module with secure embedded heat pipe
IBM0 citations61
US11882645B2Jan 23, 2024
Multi chip hardware security module
IBM0 citations61
US11614497B2Mar 28, 2023
Leakage characterization for electronic circuit temperature monitoring
IBM0 citations61
US11382210B1Jul 5, 2022
Dielectric material change to optimize electrical and mechanical properties of flex circuit
IBM0 citations61
US12005148B2Jun 11, 2024
Coolant-cooled heat sink(s) with associated ultra-violet light assembly
IBM0 citations60
US12581600B2Mar 17, 2026
Generation of random security circuit patterns for in-situ fabrication of tamper-respondent sensors
IBM0 citations59
US11026324B2Jun 1, 2021
Creating a secure volume
IBM0 citations59
US10932374B2Feb 23, 2021
3-D flex circuit forming
IBM0 citations59
US12414229B2Sep 9, 2025
Tearing security feature of printed circuit substrates
IBM0 citations57
US11765816B2Sep 19, 2023
Tamper-respondent assemblies with pressure connector assemblies
IBM0 citations49
US11716808B2Aug 1, 2023
Tamper-respondent assemblies with porous heat transfer element(s)
IBM0 citations49