Inventor
CHEN CHANG-SHENG
TW50 patents
⚠️ This page may combine multiple inventors who share the name “CHEN CHANG-SHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IND TECH RES INST
33 patentsUS7868727B2Jan 11, 2011
Inter-helix inductor devices
IND TECH RES INST26 citations92
US7068122B2Jun 27, 2006
Miniaturized multi-layer balun
IND TECH RES INST27 citations92
US8018397B2Sep 13, 2011
High dielectric antenna substrate and antenna thereof
IND TECH RES INST10 citations84
US7928824B2Apr 19, 2011
Inductor devices
IND TECH RES INST7 citations84
US7714590B2May 11, 2010
Method for testing component built in circuit board
IND TECH RES INST9 citations84
US7551052B2Jun 23, 2009
Embedded inductor devices and fabrication methods thereof
IND TECH RES INST14 citations84
US7345366B2Mar 18, 2008
Apparatus and method for testing component built in circuit board
IND TECH RES INST10 citations84
US8018299B2Sep 13, 2011
Band-pass filter circuit and multi-layer structure and method thereof
IND TECH RES INST7 citations83
US7764512B2Jul 27, 2010
Mirror image shielding structure
IND TECH RES INST7 citations74
US7471166B2Dec 30, 2008
Balanced-to-unbalanced transformer embedded with filter
IND TECH RES INST7 citations72
US6813138B1Nov 2, 2004
Embedded microelectronic capacitor equipped with geometrically-centered electrodes and method of fabrication
IND TECH RES INST9 citations70
US7446711B2Nov 4, 2008
High dielectric antenna substrate and antenna thereof
IND TECH RES INST3 citations63
US11081805B2Aug 3, 2021
Antenna array and collision avoidance radar having the same
IND TECH RES INST0 citations62
US8035036B2Oct 11, 2011
Complementary mirror image embedded planar resistor architecture
IND TECH RES INST2 citations62
US7940157B2May 10, 2011
Resistor layout structure and manufacturing method thereof
IND TECH RES INST3 citations62
US7932802B2Apr 26, 2011
Meander inductor and substrate structure with the same
IND TECH RES INST2 citations62
US7911318B2Mar 22, 2011
Circuit boards with embedded resistors
IND TECH RES INST2 citations62
US7830241B2Nov 9, 2010
Film resistor embedded in multi-layer circuit board and manufacturing method thereof
IND TECH RES INST4 citations62
US7796006B2Sep 14, 2010
Suspension inductor devices
IND TECH RES INST6 citations62
US7529103B2May 5, 2009
Multi-layered printed circuit board embedded with filter
IND TECH RES INST5 citations62
US7528433B2May 5, 2009
Capacitor structure
IND TECH RES INST2 citations62
US7515435B2Apr 7, 2009
Multi-functional composite substrate structure
IND TECH RES INST5 citations62
US6969912B2Nov 29, 2005
Embedded microelectronic capacitor incorporating ground shielding layers and method for fabrication
IND TECH RES INST5 citations60
US7102874B2Sep 5, 2006
Capacitive apparatus and manufacturing method for a built-in capacitor with a non-symmetrical electrode
IND TECH RES INST6 citations58
US8049512B2Nov 1, 2011
Circuit board with embedded components and manufacturing and measuring method thereof
IND TECH RES INST1 citations52
US7308377B2Dec 11, 2007
Test method of embedded capacitor and test system thereof
IND TECH RES INST0 citations52
US7994885B2Aug 9, 2011
High-frequency switch in multi-layer substrate
IND TECH RES INST1 citations51
US7446995B2Nov 4, 2008
Symmetrical capacitor
IND TECH RES INST1 citations51
US12009341B2Jun 11, 2024
Integrated antenna package structure
IND TECH RES INST0 citations48
US12555019B2Feb 17, 2026
Quantum device and microwave device
IND TECH RES INST0 citations43
US7936243B2May 3, 2011
Adjustable resistor embedded in multi-layered substrate and method for forming the same
IND TECH RES INST0 citations41
US7948355B2May 24, 2011
Embedded resistor devices
IND TECH RES INST0 citations40
US9205525B2Dec 8, 2015
System and method for offsetting measurement of machine tool
IND TECH RES INST0 citations36
SILICONIX INC
3 patentsUS6392290B1May 21, 2002
Vertical structure for semiconductor wafer-level chip scale packages
SILICONIX INC171 citations97
US7394150B2Jul 1, 2008
Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys
SILICONIX INC35 citations91
US7238551B2Jul 3, 2007
Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys
SILICONIX INC37 citations91