Inventor

FREYMAN BRUCE J

US17 patents

⚠️ This page may combine multiple inventors who share the name “FREYMAN BRUCE J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FREYMAN BRUCE J

MOTOROLA INC

Leadless pad array chip carrier

Integrated circuit package having a face-to-face IC chip arrangement

Method of making a transfer molded semiconductor device

Transfer molded semiconductor device package with integral shield

Fabrication of pad array carriers from a universal interconnect structure

Moisture relief for chip carrier

Method of making an ultra high density pad array chip carrier

Ultra high density pad array chip carrier

Flexible film chip carrier having a flexible film substrate and means for maintaining planarity of the substrate

Grounding an ultra high density pad array chip carrier

Overmolded semiconductor package with anchoring means

AMKOR TECHNOLOGY INC

Carrier strip and molded flex circuit ball grid array and method of making

Method of making a molded flex circuit ball grid array

Carrier strip and molded flex circuit ball grid array

Grid array assembly of circuit boards with singulation grooves

Method of making grid array assembly

Mold runner removal from a substrate-based packaged electronic device