Inventor
MATTHEW LINDA C
US12 patents
Patents
12 patentsUS5374454ADec 20, 1994
Method for conditioning halogenated polymeric materials and structures fabricated therewith
IBM71 citations96
US5343366AAug 30, 1994
Packages for stacked integrated circuit chip cubes
IBM141 citations96
US5268815ADec 7, 1993
High density, high performance memory circuit package
IBM74 citations93
US5480841AJan 2, 1996
Process of multilayer conductor chip packaging
IBM36 citations92
US5399902AMar 21, 1995
Semiconductor chip packaging structure including a ground plane
IBM25 citations92
US5546655AAug 20, 1996
Method of applying flex tape protective coating onto a flex product
IBM21 citations91
US5242713ASep 7, 1993
Method for conditioning an organic polymeric material
IBM28 citations91
US5203955AApr 20, 1993
Method for etching an organic polymeric material
IBM28 citations90
US5360946ANov 1, 1994
Flex tape protective coating
IBM13 citations81
US5462628AOct 31, 1995
Method for bonding two surfaces together
IBM12 citations73
US5074969ADec 24, 1991
Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate
IBM8 citations73
US5038195AAug 6, 1991
Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate
IBM4 citations62