Inventor

YU JICK M

US20 patents

⚠️ This page may combine multiple inventors who share the name “YU JICK M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YU JICK M

APPLIED MATERIALS INC

Selective ruthenium deposition on copper materials

Sputter deposition and etching of metallization seed layer for overhang and sidewall improvement

Reduction of copper dewetting by transition metal deposition

Remote plasma source for pre-treatment of substrates prior to deposition

Partially filling copper seed layer

Method and apparatus for forming a barrier layer on a substrate

Diffusion enhanced ion plating for copper fill

Method for improving electromigration lifetime of copper interconnection by extended post anneal

Oxidized barrier layer

INTEL CORP

MOS rear end processing

Conductor fill reflow with intermetallic compound wetting layer for semiconductor fabrication

MOS rear end processing

Low temperature aluminum alloy plug technology

Integration of annealing capability into metal deposition or CMP tool

YU JICK M

Process for selective growth of films during ECP plating

Methods for forming layers on a substrate

Methods for depositing a layer on a substrate using surface energy modulation

FU XINYU

Plasma treatment of substrates prior to deposition

Method for segregating the alloying elements and reducing the residue resistivity of copper alloy layers

LUO QIAN

Cu surface plasma treatment to improve gapfill window