P

Inventor

MATSUSE KIMIHIRO

JP18 patents

Patents

18 patents
US6861356B2Mar 1, 2005

Method of forming a barrier film and method of forming wiring structure and electrodes of semiconductor device having a barrier film

TOKYO ELECTRON LTD245 citations99
US6576062B2Jun 10, 2003

Film forming apparatus and film forming method

TOKYO ELECTRON LTD612 citations99
US6454909B1Sep 24, 2002

Method and apparatus for forming a film on an object to be processed

TOKYO ELECTRON LTD351 citations98
US5647945AJul 15, 1997

Vacuum processing apparatus

TOKYO ELECTRON LTD308 citations98
US5951772ASep 14, 1999

Vacuum processing apparatus

TOKYO ELECTRON LTD104 citations97
US6251188B1Jun 26, 2001

Apparatus for forming laminated thin films or layers

TOKYO ELECTRON LTD60 citations96
US6022586AFeb 8, 2000

Method and apparatus for forming laminated thin films or layers

TOKYO ELECTRON LTD54 citations96
US5997651ADec 7, 1999

Heat treatment apparatus

TOKYO ELECTRON LTD68 citations96
US6919273B1Jul 19, 2005

Method for forming TiSiN film, diffusion preventive film comprising TiSiN film, semiconductor device and its production method, and apparatus for forming TiSiN film

TOKYO ELECTRON LTD21 citations92
US6838376B2Jan 4, 2005

Method of forming semiconductor wiring structures

TOKYO ELECTRON LTD27 citations92
US6251191B1Jun 26, 2001

Processing apparatus and processing system

TOKYO ELECTRON LTD37 citations92
US4913790AApr 3, 1990

Treating method

TOKYO ELECTRON LTD50 citations91
US7829144B2Nov 9, 2010

Method of forming a metal film for electrode

TOKYO ELECTRON LTD7 citations74
US7153773B2Dec 26, 2006

TiSiN film forming method, diffusion barrier TiSiN film, semiconductor device, method of fabricating the same and TiSiN film forming system

TOKYO ELECTRON LTD9 citations73
US6404021B1Jun 11, 2002

Laminated structure and a method of forming the same

TOKYO ELECTRON LTD8 citations73
US6245673B1Jun 12, 2001

Method of forming tungsten silicide film

TOKYO ELECTRON LTD7 citations73
US6489208B2Dec 3, 2002

Method of forming a laminated structure to enhance metal silicide adhesion on polycrystalline silicon

TOKYO ELECTRON LTD0 citations51
US11114321B2Sep 7, 2021

Apparatus and method for real-time sensing of properties in industrial manufacturing equipment

TOKYO ELECTRON LTD0 citations47