Inventor
HEY PETER
US8 patents
Patents
8 patentsUS6258223B1Jul 10, 2001
In-situ electroless copper seed layer enhancement in an electroplating system
APPLIED MATERIALS INC399 citations99
US6436267B1Aug 20, 2002
Method for achieving copper fill of high aspect ratio interconnect features
APPLIED MATERIALS INC105 citations98
US6258220B1Jul 10, 2001
Electro-chemical deposition system
APPLIED MATERIALS INC443 citations98
US6635157B2Oct 21, 2003
Electro-chemical deposition system
APPLIED MATERIALS INC43 citations95
US6494219B1Dec 17, 2002
Apparatus with etchant mixing assembly for removal of unwanted electroplating deposits
APPLIED MATERIALS INC47 citations91
US7497932B2Mar 3, 2009
Electro-chemical deposition system
APPLIED MATERIALS INC9 citations82
US6808612B2Oct 26, 2004
Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio
APPLIED MATERIALS INC7 citations73
US6893548B2May 17, 2005
Method of conditioning electrochemical baths in plating technology
APPLIED MATERIALS INC5 citations63