Inventor
FUJIHARA TERUHISA
JP5 patents
Patents
5 patentsUS6163069ADec 19, 2000
Semiconductor device having pads for connecting a semiconducting element to a mother board
MITSUBISHI ELECTRIC CORP27 citations88
US6462406B2Oct 8, 2002
Semiconductor device and lead frame
MITSUBISHI ELECTRIC CORP8 citations71
US6787389B1Sep 7, 2004
Semiconductor device having pads for connecting a semiconducting element to a mother board
MITSUBISHI ELECTRIC CORP9 citations69
US6372546B2Apr 16, 2002
Method of producing semiconductor device and configuration thereof, and lead frame used in said method
MITSUBISHI ELECTRIC CORP5 citations59
US6252306B1Jun 26, 2001
Method of producing semiconductor device and configuration thereof, and lead frame used in said method
MITSUBISHI ELECTRIC CORP1 citations48