Inventor

TOMIZAWA SHINICHI

JP3 patents

Patents

3 patents

US6884696B2Apr 26, 2005

Method for producing bonding wafer

SHINETSU HANDOTAI KK36 citations91

US7531425B2May 12, 2009

Method of fabricating bonded wafer

SHINETSU HANDOTAI KK10 citations82

US6797632B1Sep 28, 2004

Bonded wafer producing method and bonded wafer

SHINETSU HANDOTAI KK15 citations82