P

Inventor

LIAO HSIU-HAN

TW31 patents
⚠️ This page may combine multiple inventors who share the name “LIAO HSIU-HAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WINBOND ELECTRONICS CORP

23 patents
US7906396B1Mar 15, 2011

Flash memory and method of fabricating the same

WINBOND ELECTRONICS CORP35 citations92
US11823738B2Nov 21, 2023

Resistive memory apparatus

WINBOND ELECTRONICS CORP0 citations62
US12471277B2Nov 11, 2025

Memory device and method of manufacturing the same

WINBOND ELECTRONICS CORP0 citations61
US11974428B2Apr 30, 2024

Memory device and method of manufacturing the same

WINBOND ELECTRONICS CORP0 citations61
US11877447B2Jan 16, 2024

Manufacturing method of semiconductor structure and flash memory

WINBOND ELECTRONICS CORP0 citations61
US11805644B2Oct 31, 2023

Manufacturing method of memory device

WINBOND ELECTRONICS CORP0 citations61
US11678484B2Jun 13, 2023

Semiconductor structure and manufacturing method thereof and flash memory

WINBOND ELECTRONICS CORP1 citations61
US11257833B2Feb 22, 2022

Memory device and manufacturing method thereof

WINBOND ELECTRONICS CORP0 citations61
US11251273B2Feb 15, 2022

Non-volatile memory device and method for manufacturing the same

WINBOND ELECTRONICS CORP0 citations61
US10615087B2Apr 7, 2020

Semiconductor wafer with test key structure

WINBOND ELECTRONICS CORP1 citations61
US12438004B2Oct 7, 2025

Method for forming semiconductor device that includes flash memory

WINBOND ELECTRONICS CORP0 citations59
US11257922B2Feb 22, 2022

Self-aligned contact and method for forming the same

WINBOND ELECTRONICS CORP0 citations58
US12520487B2Jan 6, 2026

Semiconductor structure and method of forming the same

WINBOND ELECTRONICS CORP0 citations56
US7656704B2Feb 2, 2010

Multi-level operation in nitride storage memory cell

WINBOND ELECTRONICS CORP2 citations54
US9356235B2May 31, 2016

Structure and formation method of memory device

WINBOND ELECTRONICS CORP0 citations51
US9166160B1Oct 20, 2015

Resistive random access memory and method of fabricating the same

WINBOND ELECTRONICS CORP0 citations51
US11839076B2Dec 5, 2023

Semiconductor structure and method of forming the same

WINBOND ELECTRONICS CORP0 citations50
US11638378B2Apr 25, 2023

Method of fabricating semicondoctor device

WINBOND ELECTRONICS CORP0 citations50
US10971508B2Apr 6, 2021

Integrated circuit and method of manufacturing the same

WINBOND ELECTRONICS CORP0 citations50
US10147730B2Dec 4, 2018

Memory device and method of manufacturing the same

WINBOND ELECTRONICS CORP0 citations50
US9972631B2May 15, 2018

Memory device and method of manufacturing the same

WINBOND ELECTRONICS CORP0 citations50
US7560338B2Jul 14, 2009

Manufacturing method of non-volatile memory

WINBOND ELECTRONICS CORP1 citations50
US11362098B2Jun 14, 2022

Method for manufacturing memory device

WINBOND ELECTRONICS CORP0 citations49

CHIANG LU-PING

3 patents

TAIWAN SEMICONDUCTOR MFG

2 patents

WINDBOND ELECTRONICS CORP

1 patent

LIAO HSIU-HAN

1 patent

WINBOND ELECTROICS CORP

1 patent