Inventor

LEE TA-CHUN

TW3 patents

⚠️ This page may combine multiple inventors who share the name “LEE TA-CHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ADVANCED SEMICONDUCTOR ENG

1 patent

US8367473B2Feb 5, 2013

Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereof

ADVANCED SEMICONDUCTOR ENG12 citations82

APPELT BERND KARL

1 patent

US8399776B2Mar 19, 2013

Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package

APPELT BERND KARL16 citations81

LEE TA-CHUN

1 patent

US8618677B2Dec 31, 2013

Wirebonded semiconductor package

LEE TA-CHUN0 citations38